Vacuum plasma cleaner
Plasma cleaner uses an excitation power supply to ionize gas into a plasma state. The plasma acts on the product surface to clean contaminants, increase surface activity, and enhance adhesion. Plasma cleaning is a new, environmentally friendly, efficient, and stable surface treatment method.
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Physical property testing
Electronics and Electrical Engineering
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- Product Description
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- Commodity name: Vacuum plasma cleaner
Plasma cleaner uses an excitation power supply to ionize gas into a plasma state. The plasma acts on the product surface to clean contaminants, increase surface activity, and enhance adhesion. Plasma cleaning is a new, environmentally friendly, efficient, and stable surface treatment method.
Product Details
Vacuum plasma cleaner. Gas is ionized into a plasma state by an excitation power supply. The plasma acts on the product surface, cleaning surface contaminants, improving surface activity, and enhancing adhesion. Plasma cleaning is a new, environmentally friendly, efficient, and stable surface treatment method.
I. Introduction:
1. Overview
Vacuum plasma cleaner. Gas is ionized into a plasma state by an excitation power supply. The plasma acts on the product surface, cleaning surface contaminants, improving surface activity, and enhancing adhesion. Plasma cleaning is a new, environmentally friendly, efficient, and stable surface treatment method.
2. Product Features
Flexible and versatile product placement fixtures to accommodate irregular products;
Horizontal electrode design to meet the processing needs of flexible products;
Low energy consumption and gas consumption products;
Convenient plate loading and unloading method;
Integrated vacuum system, small footprint;
Reasonable plasma reaction space for more uniform processing;
Integrated control system design for easier operation;
3. Industry Applications
Mobile phone industry: Cleaning and activation of TP, mid-frame, and back cover surfaces;
PCB/FPC industry: Cleaning of internal drill contamination and surfaces, roughening and cleaning of Coverlay surfaces;
Semiconductor industry: Semiconductor packaging, camera modules, LED packaging, BGA packaging, pre-treatment for Wire Bond;
Ceramics: Pre-treatment for packaging and dispensing;
Surface roughening and etching: PI surface roughening, PPS etching, removal of semiconductor silicon wafer PN junctions, ITO film etching;
Plastic materials: Activation of Teflon surfaces, activation of ABS surfaces, and cleaning and activation of other plastic materials;
Surface cleaning before ITO coating.
II. Technical Specifications:
1. Equipment Specifications
Power System
RF Power Supply Intermediate Frequency Power Supply Power 0~600W 0~2000W Frequency 13.56MHz 40KHz Vacuum System Two-stage rotary vane pump (oil pump) 60m3/h Vacuum pipeline All stainless steel pipelines, and high-strength vacuum corrugated pipes Material Aluminum alloy (stainless steel chamber can be customized) Thickness 25mm Sealability Military-grade welding seal Internal dimensions of the chamber 450×450×500mm (Width × Height × Depth) Effective size of the electrode plate 420×411mm (Width × Depth) Usable space distance 22.5mm Electrode plate arrangement method Horizontal arrangement, movable and extractable Work tray Standard configuration, material optional (aluminum, steel wire mesh) Work space 8 layers Gas System Flow range 0~300SCCM Process gas pipeline Standard two channels, customizable Control System System control PLC Delivery method 7-inch touch screen Other parameters External dimensions 900×1750×1000mm (Width × Height × Depth) Weight 200KG Equipment appearance color Silver gray 2. Factory Utility Requirements
AC power specifications Power: AC380V, 50/60Hz, 5-wire, 50A Factory exhaust Flow rate: 2.0 m3/min Factory working gas requirements
Flow rate: 1~10 L/min
Pressure: 3~7 kg/cm2
Pipe diameter: 6×4 mm
Material: PU tube
Purity: 99.99% and above
Factory compressed air requirements
Flow rate: 1~10 L/min
Pressure: 3~7 kg/cm2
Pipe diameter: 8×5 mm
Material: PU tube
Dew point: Below -40℃
Particle＞0.3μm：10Pcs/ft3
3. General Specifications
Danger Sign High Voltage Danger Sign Operating Environment Temperature: 15~30℃ Humidity: 30~70%
Other Precautions No flammable gases, corrosive gases, explosives, or reactive dusts. Gas cylinders must be secured.
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